Sculpey Adhesive - Bake N Bond

Sculpey Bake N Bond — a bake-cured adhesive

Bake N Bond is a liquid adhesive intended for polymer modeling clays. It is applied before baking and the joint forms only during baking, when the adhesive cures together with the clay. It serves above all to join raw, unbaked clay to clay that has already been baked and to hold details firmly in place. It is not a model or a kit but a bench aid.

Use

• Joining unbaked polymer clay to a part that has already been baked.
• Holding small details and add-ons in place before baking.
• Filling and strengthening the gaps between parts of a model made of polymer clay.
• It is applied in a thin layer; the joint forms only on curing in the oven.

Who it is for

For modelers and sculptors working with polymer modeling clay who need to join individual parts reliably or to add details without the risk of them falling off.

Use it according to the maker's instructions, in a well-ventilated area. It is not a foodstuff; keep it out of the reach of children.